Conference Programme

Paper 1 - Hardware Platform Management for MicroTCA®

Paper 3 - From customers specification to a "ready-to-run" MicroTCA® System

Paper 4 - xTCA Interworking Solutions for Current and Future Wireless Networks

Update

MicroTCA® upate from a Physics Lab's point of view
Speaker: Kay Rehlich, DESY
DESY as one member of the PIGMG xTCA for Physics Coordinating Committee will explain in this paper the requirements and the reasons for enhancements of the MicroTCA standard to include Rear Transition Modules, timing and synchronization. In cooperation with the industry these extensions of the MicroTCA standard will be used for the 3km long accelerator XFEL in Hamburg. The subcommittee PIGMG xTCA for Physics Coordinating Committee was initiated by an international group of physics labs that are using or actively exploring usage of both AdvancedTCA® and MicroTCA® platforms in experimental research machines and detectors in such diverse fields as high energy, photon, astro, fusion and medical physics.

Keynote

The long/short path from VME to xTCA for industrial applications
Presented from a major industrial system supplier for ultra sonic systems
In this Keynote an industrial customer will explain why they moved from a currently VME based solution to xTCA as the platforms for their next Generation Ultrasonic Inspection System. He will summarize the requirements from his industrial standpoint which is different from Telco and Medical Customer and show how these requirements fits to the xTCA based platforms they have chosen. A brief overview about the project will be given and explained how and why a pre-validated µTCA platform was used for the prove of concept.

The Sessions #1 and #2 will be running parallel

Session #1 - MicroTCA® Basics

Simple MicroTCA® - a reduced MicroTCA® subset and its differences to full-blown systems
Speaker: Thomas Holzapfel, powerBridge Computer
This presentation will highlight a practical interpretation of a reduced uTCA standard. It will help you to understand the principles for a reduced function set of uTCA by keeping as much compatibility for the re-.use of existing AMC modules. The session will also cover some existing solutions in SMTCA.

MicroTCA® in practice: µTCA standard and SCOPE approach – future of fat pipes?
Speaker: Heiko Körte, N.A.T
Within a MicroTCA® system data fabrics, the so called "fat pipe" fabrics, ensure the system interconnect with bandwidths between 1Gbps and 20Gbps. The µTCA specification (the “standard”) by PICMG clearly defines these fat pipes in terms of protocol and backplane connections. Other organizations like the SCOPE Alliance, representing µTCA users i.e. from the core telecom market, however, have certain requirements concerning system interconnects that are not reflected by the standard per default, but, at the first glance, even look contradictory. Beside reviewing the different requirements and explaining their pros and cons the presentation will show how these pretended contradictions can be overcome and the SCOPE requirements can be met using off-the-shelf products like the NAT-MCH and its fabrics.

Session #2 - Ruggedizing MTCA Systems

Presented by Christian Ganninger, Schroff, Irene Hahner, Kontron and Michael Burger, ept

The primary focus of MicroTCA® was the telecom market; therefore the base specification MicroTCA®.0 is defining the environmental conditions for that market place. Since the beginning, there’s a huge interest for MicroTCA® in many other markets like industrial automation, test & measurement, transportation, medical and defence. To address the special environmental requirements from these market segments, the PICMG started the working groups for the sub-specifications MicroTCA®.1 to .3 (RuggedMicroTCA®).

This session gives a status overview about MicroTCA®.1 (Air Cooled Rugged MicroTCA®), MicroTCA®.2 (Hardened Air Cooled MicroTCA®) and MicroTCA®.3 (Hardened Conduction Cooled MicroTCA®) and is showing the similarities and differences to MicroTCA.0. The different tests, like shock and vibration tests, that have been performed during the specification work will be explained and application samples will be given. There will be three papers in this session:  Rugged MicroTCA – an introduction and status overview (presented by Christian Ganninger, Schroff), Connector tests for Rugged MicroTCA (presented by Michael Burger, ept) and Rugged MicroTCA Applications (presented by Irene Hahner, Kontron).

Kontron: Schroff:

The Sessions #3 and #4 will be running parallel

Session #3 - xTCA for Telecom Applications

Packet Processor versus x86 – a performance duel
Speaker: Gene Juknevicius (GE EntSol, Intelligent Platforms)
Telecommunication, Industrial and even Military markets are adopting packetized communication models. This migration to communication using packets brings along requirements to perform packet processing at high data rates. Examples of such applications are virus scanning, content checking, testing equipment, lawful intercept, etc. In the last few years Packet Processors, devices that are purposely built for packet processing, have been enjoying large acceptance. Packet Processors claim to have a significant I/O performance advantage over traditional x86 processors. How big is this advantage? This presentation will focus on answering this question. Data presented will be based on real measurements comparing Packet Processor AMC with x86 AMC. Live demonstration will be available at the stand to provide the backup.

Carrier Ethernet Packet Processing
Speaker: Wolfgang Hüther, Kontron
Ethernet is becoming more and more important in Access Networks. In DSL based networks, it is replacing ATM for traffic aggregation. For end-users, end-to-end connectivity between different locations over Ethernet is becoming essential with growing demand on performance. Carrier Ethernet summarizes the use of Ethernet on public network infrastructure. Organisations such as the Metro Ethernet Forum (MEF), IEEE and ITU-T cover the use of Ethernet for end-to-end connectivity, services and transition from current technologies with respect to applicable standards. Given the high number of subscribers and massive data streams, Carrier Ethernet has extremely high demands on packet processing. The presentation summarizes requirements on packet processing for different network elements, applicable standards and shows how to design systems from COTS components for both Hardware and Software.

Architecture and Topology Considerations for Deep Packet Inspection in Security Applications using xTCA
Speaker: Christian Engels, Emerson Network Power
As telecom networks continue to evolve towards a flat, all-IP topology, the subjects of packet inspection and security become more and more pressing. As a leading enabling technology for next generation networks, ATCA can be used to implement the specialist elements that can govern and enforce packet security. This short presentation outlines how elements from the ATCA ecosystem can be integrated together to create a scalable and reliable security platform citing an actual customer example.

Session #4 - xTCA for Industrial Applications

IO-Boards in MicroTCA - Development Guide and Starter Kit
Speaker: Wolfgang Haubner, Gateware
While many designs for IO boards in CompactPCI or PMCs exist, MicroTCA places one hurdle for developers of IO boards: management by IPMI. In order to conform to the standards, AMCs need to communicate with the management controller for electronic keying, to power-up and down (incl. hot-swap) and to provide sensor readings. While the management function on AMC (the MCM) is standardized, development of IPMI software is tedious and needs to be adapted to the standard. For developers of IO boards, this represents a deviation from their target and core competencies. The contribution presents a building block for hardware and software of IPMI management on AMCs, which is ready for adaptation and deployment in customized IO boards. A starter kit provides a basic AMC design including the MMC building blocks, which can be use in a standard conforming MicroTCA environment. For the development of fabrics such as PCIe and fabric clocks, the starter kit provides tools and guidelines.

Communication Gateways - TETRA/Wifi/Wimax/LTE in Ruggedized Environments
Speaker: Irene Hahner, Kontron
Originating in Telecommunications, MicroTCA® is a natural choice for communication gateways. However, base stations for Professional Mobile Radio based on Tetra, base stations for Wifi, WiMax or base stations based on GSM or the next generation mobile radio standard LTE need compact and conduction cooled designs. The form factors specified in MicroTCA®.0 such as the MCH do not allow such designs. MicroTCA®.1 specifies new front plates for standard AMCs, MicroTCA®.3 for conduction cooled systems is on the way. The presentation shows how to implement compact conduction cooled systems for 3 to 4 AMCs in a standard compliant way. The implementations keep the management functions (MCMC) in place while skipping the original MCH form factor. Conventional AMCs are used with conduction cooled clamshells in a robust and portable housing. Sample designs include the use of different radio interface boards, assistance for customer specific developments on the AMC form factors and suitable backplanes including the MCMC function.

EtherCAT and MicroTCA®
Speaker: Vollrath Dirksen, N.A.T.
Due to its scalability MicroTCA® system is an interesting platform to be used in the industrial automation communication, where the realtime, high speed field bus EtherCAT is used. This presentation explains, how a MicroTCA system can be build as EtherCAT master and how as EtherCAT slave. Especially as EtherCAT slave powerfull new architectures can be build within EtherCAT networks.

The Sessions #5 and #6 will be running parallel

Session #5 - xTCA for Medical & Scientific

The needs of xTCA for High Energy Physics
Speaker: Nigel Forrester, Emerson Network Power
Having successfully deployed VMEbus for 25 years, the high energy physics community appreciates the advantages of Open Standards. They have chosen xTCA as their next generation architecture because of the performance, flexibility and manageability of xTCA and are working to standardize this further.

Multicore for Image Processing
Speaker: Claudia Bestler, Kontron
Pre-processing and post -processing in medical imaging has high demands ond performance and low latencies.A suitable system design uses multible multi-core processors with tight coupling over a high speed backplane. The contribution compares different processor architectures for typical medical applications in a MicroTCA® enviroment. Among the processor types are Intel Architecture, Freescale and Cavium. The contribution also considers system aspects such as power consumption, noise and density.

Intelligent software optimization for MicroTCA® Systems
Speaker: Michael Gaudlitz, Wind River Systems
This talk will focus on leveraging the advantages of MicroTCA® systems through optimized software solutions. The topics that will be presented cover the right choice of the operating system, accompanied by best-of-class tooling support plus testing and lifetime maintenance features. Additional attention will be paid to special requirements of different markets such FDA and IEC61508 certification, integration and consolidation trends.

Session #6 - xTCA for Defence & Aerospace

Aerospace test application: How to bring in different IO into a PCIe based multiprocessor MTCA system
Speaker: Vollrath Dirksen, N.A.T.
SRIO is selected for multiprocessing, PCIe for IO centric applications. But how to build an IO centric application with the demand of high performance requirements only achievable with a multiprocessor system? This presentation shows an aerospace test application with a rich mixture of different IO (fast and slow) with various interfaces like CAN, EtherCat based, PCIe, PMC, PCI, cPCI integrated in multiple MicroTCA® chassis with the computing power of multiple, multi core CPU boards. The control system uses minimum 6 monitors with separated images and extended images.

Technology change between PCI and MTCA in a rugged ATR Chassis
Speaker: Friedrich Fix, Elma Trenew
This presentation introduces a real life example for a technology change. It explains the steps from MTCA Telecom version to a version with hardened card guides and screwed front panels, design features for the card guides and additional tests with results. Moreover the presentation shows how to redesign AMCs from PCI to MTCA and demonstrates the space saving in comparison of both systems.

Design options for PCIe-based xTCA platforms
Speaker: David Rigg;  GE Intelligent Platforms
Beside GbE and SRIO, PCIe based xTCA platforms are generating more and more interest in the Market. In this presentation the design options with PCIe will be explained to show how small and cost effective µTCA platforms can be build, utilizing PCI-e switch and switchless, point to point connectivity. Furthermore, architecture options for multi-processor implementations, either as standalone or clusters, will be covered. Finally, options related to failover and Root Complex movement will be discussed.

The Sessions #7 and #8 will be running parallel

Session #7 - High Performance Fabrics - Comparing SRIO, PCIe and 10 GbE/XAUI

Speakers H. Erd, GE Fanuc, I.Hahner, Kontron
One of the prominent features of MicroTCA® is the use of high speed fabrics over serial links on the backplane at 10 Gigabits per second. It provides a choice of PCI-Express (PCIe), Serial Rapid IO (SRIO) and 10 Gigabit Ethernet (10GbE over XAUI). This session shows how to use high-speed fabrics in MicroTCA®. System design allows using single fabrics or multiple fabrics in parallel, switched fabrics or point-to-point topologies, and redundant designs. The next topic is the comparison of fabrics in terms of the programming model (memory map versus socket interface), the functionality (protocol features) and performance (in terms of throughput, latency and delays depending on the traffic mix). The presentation shows benchmark results from the suppliers’ labs. It concludes with practical guidelines for implementation.

GE Fanuc: Kontron:

Session #8 - Cooling of MicroTCA® Systems

Thermal design considerations for AMCs
presented by Advantech
This presentation describes some of the thermal challenges that face the designer of an AdvancedMC for deployment in a MicroTCA system or on an ATCA blade. It demonstrates several techniques which are employed to rationalize development and ensure a good thermal design during the PCB design process. The presentation will look at how advanced thermal profiling with software tools such as Flowtherm,  facilitates collaboration particularly during the conceptual phase. Potential interoperability issues can be addressed more efficiently when both board and chassis manufacturers work together during floor or system planning exercises , quickly running thermal compliance checks and providing clear thermal feedback to the group for the overall system design.

Thermal simulation, design and measurements of a MicroTCA system
presented by Schroff
MicroTCA is defining high performance systems in a very small form factor. But high processing power goes along with a superior power need. The maximum power consumption of an AdvancedMC module is 80W. The maximum power consumption of a 19” MicroTCA® subrack is specified with 1160 W. This needs a special thermal design of the AdvancedMC modules and the MicroTCA system. This presentation describes the thermal simulation of MicroTCA systems, special design examples for optimizing the air flow and takes a look at thermal measurements as the tool for thermal design verification. The presentation will also show the influence of the thermal design of the AdvancedMC module for the chassis cooling.

Wrap-up and Prize Draw

From

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13:40

Paper 1

Hardware Platform Management for MicroTCA®
Speaker - Mark Overgaard, Pigeon Point Systems
The hardware platform management subsystem of MicroTCA® is a critical part of the value that many customers see in MicroTCA®, enabling a wide range of management facilities all the way from collecting simple inventory information about the modules in a system, to monitoring shelf temperatures and managing fan speeds to keep them in line, and on to supporting high availability concepts like redundancy. This presentation provides an overview of hardware platform management in MicroTCA®, delivered by an expert who has been involved (often in a leadership role) throughout the development and maturation of the AdvancedTCA, AdvancedMC and MicroTCA® management architectures.

13:40

14:00

Paper 2

Plug Connector as a replacement of the AdvancedMC card edge gold pads
Speaker: Michael Seele, Harting
The AdvancedMC card edge interface with its gold pads is in discussion still today. It is not accepted by a lot of users due to technical disadvantages, sometimes also due to psychological reasons. This fact contributes to the market development of MicroTCA® which is still behind the expectations. The presentation shows the advantages of the HARTING Plug Connector for AdvancedMC and MCH modules. The Plug connector replaces the card edge gold pads and offers an increased contact reliability.

From customers specification to a "ready-to-use" MicroTCA® System
Speaker: Florian Faltin, Elma Trenew Electronic
What are the criteria to use MicroTCA® for a certain application? Which protocols are used? Which interconnections have to be implemented on the Backplane? What kind of AMCs fits into the concept? This presentation will show the development process from kick-off meeting up to a "ready-to-run" MicroTCA® System.

Paper 4

xTCA Interworking Solutions for Current and Future Wireless Networks
presented by Marc Orange, Interphase
While operating 2G / 3G networks, deploying Femtocell access, and preparing for LTE roll-out, wireless operators look for solutions to interconnect efficiently these different environments. Come take a closer look at these crucial interworking touch-points and hear how Interphase is addressing them with its xTCA / AMC solutions.

Paper 5

Tuning MicroTCA Platforms to meet Design-to-Cost objectives
presented by Peter Marek. Advantech
This presentation describes how MicroTCA based platforms bring greater benefits over proprietary hardware and software solutions. It describes the advantages of software defined hardware functions on open platforms using general purpose processors. In addition, it addresses ways in which Advantech has cost optimized one specific MicroTCA design, making it economically viable for volume cellular base station deployment whilst conforming to and retaining all the advantages of an open standard specification.

Paper 6

Roadway to Run Rate - Shortcuts to Faster Deployments Using Application-Ready Systems
presented by Performance Technologies
In these economic times, reducing development costs and expediting time-to-market (or time-to-revenue) are paramount. Application-Ready Systems offer embedded designers with a solution to both problems. This session will discuss how time and resources can be reduced using the Application-Ready Systems approach for your next development program. This presentation will review what a comprehensive Application-Ready System is made of; a hardware platform with power and cooling, switching infrastructure, payload boards (e.g. CPUs, Storage, Video, IO/Access, etc.), operating system, enabling software, and shelf management interfaces, all pre-configured and pre-tested together, and supported by one company.